ENGLEWOOD, CO, June 20, 2019 (GLOBE NEWSWIRE) --
is continuously innovating so what's the big deal? The issue is a
coming change in the kind of innovation needed. "We've been moving fast
in pretty much one direction for decades and that's about to change",
says Michael Lebby, CEO of Lightwave Logic.
Several years ago,
there was a sudden turn in the roadmap for transistors and IC's that
some called the demise of Moore's Law. Now a similar end of the road is
approaching for the interconnects between chips, including both
electrical and photonic (optical) interconnects.
At the World
Technology Mapping Forum's latest working session held last week in
Berlin, the participants agreed that radically different architectures
and solutions will be needed during the next decade for a number of
markets which has implications on technical decisions being made now.
Lebby, who chaired the Datacenter Applications session, also gave one of the keynotes (https://lightwavelogic.com/LWLG-presents-as-part-of-WTMF19)
where he called for radical innovation, specifically a shift to faster
photonic components, a direction he exemplified with his company's novel
electro-optic polymers that promise 100 Gbps sub-volt operation.
pretty much accepted that 100 Gbps is about as fast as you want copper
traces on circuit boards to go. When we get there, and people are
already working on it, the path suddenly comes to a T-junction. Some of
the prevalent photonic technologies are also coming to a speed limit,
so we've got just one generation to figure out what direction we should
go when we reach the cross-roads."
The Forum began when two
existing organizations that came out of the silicon photonics and indium
phosphide communities recognized the urgency of addressing this
navigational challenge together. Participants have now extended its
scope beyond bilateral cooperation between these incumbent technologies
to bring forward new innovative material systems including thin-film
ferro-electrics, thin-film lithium niobate-and polymers.
Logic is not the only company working on polymers for photonic
interconnect, although it is the only one currently in the process of
commercializing extremely high-speed devices using its own proprietary
polymer material. For higher performing, higher density equipment in
networks and datacenters, there is broad interest in moving interconnect
photonics much closer to the electronics switching chips in a new
architecture called co-packaged optics. In his talk Lebby pointed to
the set of active and passive polymer devices and waveguides currently
under development by a number of organizations as a promising way to
implement co-packaged optics.
Following the conference, Lebby
expressed satisfaction with the level of agreement amongst the
participants. "We pretty much agreed that the target functionality for
photonic interconnects is a 10-fold increase in raw data-rate and a
10-fold reduction in power consumption compared to today's capabilities.
It's going to take radical innovation for this to happen. This is
exactly what we at Lightwave Logic are targeting. While this is a big
change, I'm quite confident we can get there given the activity in new
directions such as advances in electro-optic polymers."
For more information about Lightwave Logic, please visit the Company's website at lightwavelogic.com.
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Logic, Inc. is a development stage company moving toward
commercialization of next generation photonic devices using its
high-activity and high-stability organic polymers for applications in
data communications and telecommunications markets. Photonic
electro-optical devices convert data from electric signals into optical
Lightwave Logic, Inc.
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