I noted in a prior response to Coveman's question about DDIC vendor MagnaChip that EMAN's patent application for large die (e.g. 4Kx4K) shows a peripheral interconnect scheme designed for bonding to a flexible circuit, which could suggest the use of separate DDIC chips instead of similar functionality built into their Si backplane, as was mentioned in the Council of Industry piece. Wanted to provide a few more comments on this as follows...
1) Without going back to get specific quotes, AS mentioned several times recently that one of their 4Kx4K clients had built a number of sophisticated options into the Si backplane, and changes to this functionality was the reason for design iteration. This seems to fly in the face of simplifying the backplane, unless the exercise is focused on defining final functionality that will ultimately be moved to a custom IC separate from the OLED display.
2) In looking at the photo of the 4Kx4K B&W "lion" display shown on EMAN's website, there is no indication (as far as I can tell) of the typical epoxy encapsulated wirebond regions seen on all of their prior displays. This encapsulated interconnect region existed on one side of the display up through the WUXGA, then was on two opposing sides of their 2Kx2K display - they apparently needed two sides to accommodate all of the interconnects. If I'm interpreting the "lion" photo correctly, they have in fact moved to a different interconnect scheme for the 4Kx4K display that does not use wirebonds.